Copper Bath (acid) JE540
Product number:
127.1000
Product information "Copper Bath (acid) JE540"
The copper bath (acid) JE540 is a universally applicable electroplating electrolyte. It is suitable for frame and barrel plating. Because of its excellent throwing power and adehesive strength the electolyte is often used as an under coat before further electroplating processes. The copper layers are fine-grained and slightly bright and create a very good adhesion between base material and final layer.
Operating data:
Copper content: 55 g/L (45 – 65)
Sulfuric acid content: 60 g/L (55 – 75)
Chloride content: 70 mg/L (50 – 100)
pH-value: < 1
Operating conditions:
Voltage: 1,6-3 Volt
Current density: 1 - 6 A/dm²
Bath temperature: 20-30 °C
Exposition time: 2-15 min.
Anodes: copper
Goods movement: required
Bath filtration: from 10 liter
Tank material: PPH, PP or PE
Deposition data:
Hardness: approx. 220 HV
Layer density: 8.9 g/cm³
Operating data:
Copper content: 55 g/L (45 – 65)
Sulfuric acid content: 60 g/L (55 – 75)
Chloride content: 70 mg/L (50 – 100)
pH-value: < 1
Operating conditions:
Voltage: 1,6-3 Volt
Current density: 1 - 6 A/dm²
Bath temperature: 20-30 °C
Exposition time: 2-15 min.
Anodes: copper
Goods movement: required
Bath filtration: from 10 liter
Tank material: PPH, PP or PE
Deposition data:
Hardness: approx. 220 HV
Layer density: 8.9 g/cm³
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