The copper bath (acid) JE540 is a universally applicable electroplating electrolyte. It is suitable for frame and barrel plating. Because of its excellent throwing power and adehesive strength the electolyte is often used as an under coat before further electroplating processes. The copper layers are fine-grained and slightly bright and create a very good adhesion between base material and final layer.Operating data:Copper content: 55 g/L (45 – 65)Sulfuric acid content: 60 g/L (55 – 75)Chloride content: 70 mg/L (50 – 100)pH-value: < 1Operating conditions:Voltage: 1,6-3 VoltCurrent density: 1 - 6 A/dm²Bath temperature: 20-30 °CExposition time: 2-15 min.Anodes: copperGoods movement: requiredBath filtration: from 10 literTank material: PPH, PP or PEDeposition data:Hardness: approx. 220 HVLayer density: 8.9 g/cm³

The Cyanide Copper Bath JE550 is suitable for frame and barrel plating. Because of its excellent throwing power and adehesive strength the electolyte is often used as an under coat before further electroplating processes. The copper layers are fine-grained and slightly bright and create a very good adhesion between base material and final layer.Operating data:Copper: 35 g/l CuPotassium cyanide: 25-35 g/L KCN freepH-value: 11 - 12Operating conditions:Voltage: 0,5-3 VoltBath temperature: 50-60 °CExposition time: 2-15 min.Anodes: copperAnode/Cathode surface: 1 : 1 Agitation: required Current density: 1 - 3 A/dm2 Bath filtration: from 10 liters