For coatings and electroforming
Copper bath / copper electrolyte
Here you will find our copper baths. Due to their deep dispersion, they have proven to be perfect for pre-copper plating and are also gloss-enhancing. Copper baths also offer extremely good thermal and electrical conductivity.
The copper bath (acid) JE540 is a universally applicable electroplating electrolyte. It is suitable for frame and barrel plating. Because of its excellent throwing power and adehesive strength the electolyte is often used as an under coat before further electroplating processes. The copper layers are fine-grained and slightly bright and create a very good adhesion between base material and final layer.Operating data:Copper content: 55 g/L (45 – 65)Sulfuric acid content: 60 g/L (55 – 75)Chloride content: 70 mg/L (50 – 100)pH-value: < 1Operating conditions:Voltage: 1,6-3 VoltCurrent density: 1 - 6 A/dm²Bath temperature: 20-30 °CExposition time: 2-15 min.Anodes: copperGoods movement: requiredBath filtration: from 10 literTank material: PPH, PP or PEDeposition data:Hardness: approx. 220 HVLayer density: 8.9 g/cm³ Please note that this article is a dangerous good according to the legal guidelines. For this reason we need a copy of your business registration.Therefore we kindly ask you to send us the business registration in advance.
The Cyanide Copper Bath JE550 is suitable for frame and barrel plating. Because of its excellent throwing power and adehesive strength the electolyte is often used as an under coat before further electroplating processes. The copper layers are fine-grained and slightly bright and create a very good adhesion between base material and final layer.Operating data:Copper: 35 g/l CuPotassium cyanide: 25-35 g/L KCN freepH-value: 11 - 12Operating conditions:Voltage: 0,5-3 VoltBath temperature: 50-60 °CExposition time: 2-15 min.Anodes: copperAnode/Cathode surface: 1 : 1 Agitation: required Current density: 1 - 3 A/dm2 Bath filtration: from 10 liters